Publications

STEM Career Connections: A Model for Preparing Economically-Disadvantaged Rural Youth for the Future Workforce

Description

Youth residing in mountain tourist communities represent an important and underserved rural population. Science, engineering, and computing are hidden within the daily workforce practices in these communities, unlike large metropolitan areas where technology jobs are prominent in the local culture. Youth in rural communities may think that Science, Technology, Engineering, and Mathematics (STEM) careers require them to leave their communities, which can disincentivize academic preparations [1, 2]. Youth career experiences through in-school and out-of-school programs are often general in nature, and not tied to youth’s other learning experiences [3]. Youth may be challenged to understand how these career experiences relate to their lives. Attrition of youth from middle-school programs is particularly troubling as middle school is a period in which many students lose interest in STEM and achievement gaps begin to widen [4]. Evidence suggests that disadvantaged youth are not fully participating in available career experiences, leading to unfilled science and computing-oriented internships [5]. This research presents initial findings from a pilot study of an innovative model involving working with local schools and community partners to support the integration of local career contexts, engineering design challenges, career connections, and mentorship into a 3D printing curriculum to motivate and increase interest for rural youth for future STEM careers. Preliminary data analysis suggests that the relationship between local STEM businesses and students is important to help motivate rural youth to see themselves being successful in STEM careers and can help them to realize the benefits of engaging with engineering technologies.

Publications

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PUBLICATION DETAILS

Type
Conference proceeding
Author
S. Bhaduri
Q. Biddy
M. Rummel
T. Sumner
Publisher
2021 ASEE Annual Conference
File Attachment(s)
Publication Year
2021